Remote places: Static models are typically situated remotely, escalating Expense and lowering Over-all process effectiveness.
thirty% of its peak electricity use, supplying our customers substantial reduction in running charges and amplified dependability.
With all the POU3500, you can achieve unprecedented results in etch effectiveness, chamber uptime, reduced cost of possession and fab House utilization – all though strengthening your method reliability.
initially Established in 1985, our enterprise has grown into a acknowledged leader in giving temperature Handle techniques to the global semiconductor market.
This amazing system, presenting a small kind factor, low price-of-Ownership and Dynamic Temperature Regulate offered process and products engineers a completely new Resource to enhance their temperature delicate procedures.
The precision with the POU 3300 permits impartial control of the procedure fluid temperature to your wafer chuck inside of +/- 0.one °C of set issue, and also the rapid response time with the program makes it possible for for optimum wafer-to-wafer repeatability all over the etch course of action.
All static TCUs call for excess cooling & heating capacities because of their pretty massive method fluid reservoirs. the method fuid reservoir on LAUDA-Noah's dynamic temperature Manage program is below 1 gallon.
Together with the POU3300, you are able to accomplish unparalleled ends in etch effectiveness, chamber uptime, reduced price of ownership and fab House utilization – all although enhancing your method reliability.
big Footprint: Static models occupy sizeable Place inside the fabrication Instrument area, cutting down its efficiency.
LAUDA-Noah is Conference these new problems and has incorporated Vitality preserving technologies in programs which are helpful towards the environment and also have a low priced to function.
the info set Here's from a 200mm quantity manufacturing wafer fab and Evidently illustrates the advantage of the LAUDA-Noah POU procedure.
The POU3300 procedure offers dynamic temperature control of the procedure chamber cathode / electrode / anode and will be synchronized with any etch process.
verified; TEs' characterize just one Element of a chiller's style. The switching & Management strategies used by a chiller will click here affect the TEs' dependability.
(thus, putting in a static device beside chamber is not going to empower it to offer dynamic temperature control)
We require much less cooling/heating potential for a similar application being a static TCU because of our smaller reservoir volume.